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AVX Technical Information > Decoupling/Low Inductance

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Document Title Author Date Technical Paper
AC Termination for Signal Busses Ben Smith 7/14/2006 9:38:00 AM AC Termination for Signal Busses
Decoupling: Basics AVX Corp. 7/14/2006 9:38:00 AM Decoupling: Basics
Functional Testing of Decoupling Capacitors for Dynamic RAMs A. Martin, W. Parkinson 7/14/2006 9:37:00 AM Functional Testing of Decoupling Capacitors for Dynamic RAMs
Improved Noise Suppression Via MLCs in Power-Entry Decoupling A. Martin, R. Keenan 7/14/2006 9:38:00 AM Improved Noise Suppression Via MLCs in Power-Entry Decoupling
Inductance Measurements for Multi-Terminal Devices Ben Smith 7/14/2006 9:38:00 AM Inductance Measurements for Multi-Terminal Devices
Interconnect Schemes for Low Inductance Ceramic Capacitors Jeff Cain, Ph.D. 8/10/2006 11:37:00 AM Interconnect Schemes for  Low Inductance Ceramic Capacitors
Introduction to Choosing MLC Capacitors for Bypass/Decoupling Applications AVX Corp. 7/14/2006 9:39:00 AM Introduction to Choosing MLC Capacitors for Bypass/Decoupling Applications
Land Grid Array (LGA) Low Inductance Capacitor Advantages in Military and Aerospace Applications AVX 12/19/2006 4:25:00 PM Land Grid Array (LGA) Low Inductance Capacitor Advantages in Military and Aerospace Applications
LICA (Low Inductance Capacitor Array) Flip-Chip Application Notes Jeff Cantlebary 8/10/2006 11:37:00 AM LICA (Low Inductance Capacitor Array) Flip-Chip Application Notes
LICA® Design Guide AVX 7/26/2006 11:01:00 AM LICA® Design Guide
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